Schematic, Multi-Layer Layout & Production Files
End-to-end PCB design from schematic capture to GERBER release. 2 to 8 layer stackups, impedance-controlled routing for USB, MIPI DSI, LVDS and DDR, with complete production file output including silkscreen, pick-and-place and stencil.
XTELL provides end-to-end PCB design services from a Shenzhen engineering team that has delivered production hardware since 2016. We take a project from schematic capture through multi-layer layout, signal integrity review and complete manufacturing file output — the same flow we have run on inertial and environmental sensor boards, multi-channel data acquisition cards, USB Type-C reference boards, RK-series SoC mainboards, 433MHz RF terminals and microscope motion platforms.
Our PCB design work is not drawing-only. Every board we lay out is one we also debug, because most projects reach us as hardware software co-design engagements. That feedback loop is why our production files rarely need a second spin: layout decisions are made by engineers who will be holding the board on a bench two weeks later.
We design in KiCad, handle 2-layer through 8-layer stackups, and routinely deliver impedance-controlled routing for USB, MIPI DSI, LVDS and DDR interfaces. What is handed over at the end depends on the model you choose: we work both open, where design data transfers to you, and closed, where we retain the design and ship you finished hardware. Scope is agreed before kickoff, not argued about at delivery. For projects that involve an FPGA or a Linux-capable SoC, PCB design is normally bundled with the FPGA logic or embedded Linux BSP work rather than quoted separately.
Typical engagements run three to eight weeks from kickoff to GERBER release, depending on layer count and how much of the schematic is new versus adapted from a reference design. You work in English directly with the responsible engineer — there is no account manager relaying messages.
Beyond straight layout work we take on schematic design services as a standalone engagement, high speed PCB design services where DDR, MIPI or USB timing budgets are tight, and mixed signal PCB design where an analog front end has to coexist with switching noise on the same board. Sensor boards are a recurring case of exactly that, and the sensing types vary more than the layout problem does: MEMS inertial parts such as the MPU6050, SC7A20 and STK8321 on a posture sensor, multi-channel ADC acquisition for temperature, humidity and pressure, electrochemical gas front ends, and low-power telemetry on an Apollo2 inspection terminal. In each the signal conditioning path took several revisions before readings were stable enough to trust. RF PCB design and antenna keep-out planning are handled in the same pass rather than bolted on afterwards, and analog circuit design services including ADC and DAC board design are part of the normal scope when the product needs them.
Multi-version PCB iteration on an RK3128 SoC mainboard with LCD driver adaptation. Full production output: GERBER, silkscreen, pick-and-place and stencil files.
Dual-port and single-port Type-C board designs around a PD controller and a high-speed MUX, including an alternate-device solution verified against the reference design.
BLE MCU board carrying MPU6050, SC7A20 and STK8321 MEMS inertial parts alongside an audio path, BLE radio and RFID - a dense mixed-signal layout where sensor placement, antenna keep-out and return paths decide whether the data is usable.
Interface list, power budget and mechanical constraints agreed, then schematic capture and review.
Layer count and impedance targets fixed before placement; critical nets planned first.
Impedance-controlled routing for high-speed interfaces, return path and EMC review.
Manufacturability review, then full GERBER, pick-and-place and stencil output.
First-article bring-up, rework guidance and iteration to a production-ready revision.
Three to eight weeks from kickoff to GERBER release for a typical board. A 2-layer sensor module adapted from a reference design lands at the short end; an 8-layer SoC mainboard with DDR and MIPI routing sits at the long end. Multi-version iteration, which most production boards need, is quoted separately.
Yes. We sign a mutual NDA before any technical material changes hands, and we can work from your template rather than ours. Design files, schematics and BOMs stay with the engineers assigned to your project.
It depends on which model the engagement runs under. We work open, where design data transfers to you and your team carries the product forward independently, and closed, where we retain the design and supply finished hardware on an ongoing basis. Both are normal here and priced differently. Tell us early which one fits your plan - it is settled in the quote, not at delivery.
We produce the full production file set — GERBER, drill, IPC-356 netlist, pick-and-place, stencil and a sourcing-annotated BOM — and work with Shenzhen assembly houses for prototype and small-batch runs.
Contact us for customized solutions and quotes